| Price | Negotiation |
| MOQ | 1 piece |
| Delivery Time | 3-5 work days |
| Certification | Original Parts |
| Model Number | H9TQ26ADFTACUR-KUM |
| Packaging Details | 10cm X 10cm X 5cm |
| Payment Terms | T/T, PayPal, Western Union, Escrow and others |
| Supply Ability | 500-2000pcs per month |
| Packaging Details | 10cm X 10cm X 5cm | NAND Information | 32+24 eMCP-D3 |
| Product | eMCP | Part Numbe | H9TQ26ADFTACUR-KUM |
| Model Number | H9TQ26ADFTACUR-KUM | Dissipation Power | 5W |
| Supply Ability | 500-2000pcs per month | Density | 32GB |
| Certification | Original Parts | Payment Terms | T/T, PayPal, Western Union, Escrow and others |
| Package Type | 221 ball FBGA | Price | Negotiation |
| Delivery Time | 3-5 work days | Minimum Order Quantity | 1 piece |
| Application | Mobile Phone |
EMCP Memory Chip H9TQ26ADFTACUR-KUM -32GNAND+24GLPD3 FBGA221 FW:A4-Embedded Multi-Chip Package NEW&ORIGINAL Storage
Featur and Description:
| Part Number | Density | Organization | Temperature | Product Grade | Voltage | PKG | Product Status |
| H9TQ26ADFTACUR-KUM | 32GB | SDP | 1℃-100℃ | IT | 5v | FBGA221 | Mass Production |
