Price | Negotiation |
MOQ | 1 piece |
Delivery Time | 3-5 work days |
Certification | ORIGINAL PARTS |
Model Number | i5-6300U SR2F0 |
Packaging Details | tray, 10cmX10cmX5cm |
Payment Terms | T/T, PayPal, Western Union, Escrow and others |
Supply Ability | 1000pcs |
Status | Launched | Market Segment | Mobile |
Code Name | Skylake | Lithography | 14nm |
Packaging Details | tray, 10cmX10cmX5cm | Porcessor Number | I5-6300U |
Model Number | i5-6300U SR2F0 | Use Conditon | Industrial Commercial Temp, Embedded Broad Market Commercial Temp, PC/Client/Tablet |
Supply Ability | 1000pcs | Certification | ORIGINAL PARTS |
Payment Terms | T/T, PayPal, Western Union, Escrow and others | Price | Negotiation |
Delivery Time | 3-5 work days | Minimum Order Quantity | 1 piece |
Product Collection | 6th Generation Core i5 Processors | Launch Date | Q3'15 |
Core I5-6300U SR2F0 Laptop CPU Processors Core I5 Series (3MB Cache,up to 3.0GHz ) - Notebook CPU
The
Core
i5-6300U
is
an
ULV
(ultra
low
voltage)
dual-core
SoC
based
on
the
Skylake
architecture
and
has
been
launched
in
September
2015.
The
CPU
can
be
found
in
ultrabooks
as
well
as
normal
notebooks.
In
addition
to
two
CPU
cores
with
Hyper-Threading
clocked
at
2.4
-
3.0
GHz
(2
cores:
max.
2.9
GHz),
the
chip
also
integrates
an
HD
Graphics
520
GPU
and
a
dual-channel
DDR4-2133/DDR3L-1600
memory
controller.
The
SoC
is
manufactured
using
a
14
nm
process
with
FinFET
transistors.
Processor
number
i5-6300U
Processor number | i5-6300U |
Family | Core i5 Mobile |
Technology (micron) | 0.014 |
Processor speed (GHz) | 2.4 |
L2 cache size (KB) | 512 |
L3 cache size (MB) | 3 |
The number of cores | 2 |
EM64T | Supported |
HyperThreading technology | Supported |
Virtualization technology | Supported |
Enhanced SpeedStep technology | Supported |
Execute-Disable bit feature | Supported |
General Information:
Type | CPU / Microprocessor |
Market segment | Mobile |
Family |
|
Model number |
|
Frequency | 2400 MHz |
Maximum turbo frequency |
3000
MHz
(1
core) 2900 MHz (2 cores) |
Clock multiplier | 24 |
Package | 1356-ball micro-FCBGA |
Socket | BGA1356 |
Size | 1.65" x 0.94" / 4.2cm x 2.4cm |
Introduction date |
September
1,
2015
(announcement) September 1, 2015 (availability in Asia) September 27, 2015 (availability elsewhere) |
Architecture Microarchiteture:
Microarchitecture | Skylake |
Processor core | Skylake-U |
Core stepping | D1 (SR2F0) |
Manufacturing process | 0.014 micron |
Data width | 64 bit |
The number of CPU cores | 2 |
The number of threads | 4 |
Floating Point Unit | Integrated |
Level 1 cache size |
2
x
32
KB
8-way
set
associative
instruction
caches 2 x 32 KB 8-way set associative data caches |
Level 2 cache size | 2 x 256 KB 4-way set associative caches |
Level 3 cache size | 3 MB 12-way set associative shared cache |
Physical memory | 32 GB |
Multiprocessing | Not supported |
Extensions and Technologies |
|
Low power features | Enhanced SpeedStep technology |
Integrated peripherals / components:
Display controller | 3 displays |
Integrated graphics |
GPU
Type:
HD
520 Graphics tier: GT2 Microarchitecture: Gen 9 LP Execution units: 24 Base frequency (MHz): 300 Maximum frequency (MHz): 1000 |
Memory controller |
The
number
of
controllers:
1 Memory channels: 2 Supported memory: DDR3L-1600, LPDDR3-1866, DDR4-2133 Maximum memory bandwidth (GB/s): 34.1 |
Other peripherals |
|
Electrical
/
Thermal
parameters:
Maximum operating temperature | 100°C |
Thermal Design Power | 15 Watt |