Price | Negotiation |
MOQ | 1 piece |
Delivery Time | 3-5 work days |
Certification | ORIGINAL PARTS |
Model Number | I3-6006U SR2JG |
Packaging Details | tray, 10cmX10cmX5cm |
Payment Terms | T/T, PayPal, Western Union, Escrow and others |
Supply Ability | 1000pcs |
Status | Launched | Market Segment | Mobile |
Code Name | Products formerly Skylake | Lithography | 14nm |
Packaging Details | tray, 10cmX10cmX5cm | Porcessor Number | I3-6006U |
Model Number | I3-6006U SR2JG | Use Conditon | NOTEBOOK / LAPTOP |
Supply Ability | 1000pcs | Certification | ORIGINAL PARTS |
Payment Terms | T/T, PayPal, Western Union, Escrow and others | Price | Negotiation |
Delivery Time | 3-5 work days | Minimum Order Quantity | 1 piece |
Product Collection | 6th Generation Core i3 Processors | Launch Date | Q4'16 |
CPU Processor Chip Core I3-6006U SR2JG I3 Series (3MB Cache,up to 2.0GHz ) - Notebook Processor
The
Core
i3-6006U
is
an
ULV
(ultra
low
voltage)
dual-core
SoC
based
on
the
Skylake
architecture
and
has
been
launched
in
November
2016.
The
CPU
can
be
found
in
small
and
light
notebooks.
In
addition
to
two
CPU
cores
with
Hyper-Threading
clocked
at
(rather
low)
2
GHz
(no
Turbo
Boost),
the
chip
also
integrates
an
HD
Graphics
520
GPU
(clocked
at
only
900
MHz)
and
a
dual-channel
DDR4-2133/DDR3L-1600
memory
controller.
The
SoC
is
manufactured
using
a
14
nm
process
with
FinFET
transistors.
Processor number | i3-6006U |
Family | Core i3 Mobile |
Technology (micron) | 0.014 |
Processor speed (GHz) | 2 |
L2 cache size (KB) | 512 |
L3 cache size (MB) | 3 |
The number of cores | 2 |
EM64T | Supported |
HyperThreading technology | Supported |
Virtualization technology | Supported |
Enhanced SpeedStep technology | Supported |
Execute-Disable bit feature | Supported |
General Information:
Type | CPU / Microprocessor |
Market segment | Mobile |
Family | Intel Core i3 Mobile |
Model number ? | i3-6006U |
CPU part number | § FJ8066201931106 is an OEM/tray microprocessor |
Frequency ? | 2000 MHz |
Clock multiplier ? | 20 |
Package | 1356-ball micro-FCBGA |
Socket | BGA1356 |
Size | 1.65" x 0.94" / 4.2cm x 2.4cm |
Introduction date | November 2016 |
Architecture Microarchiteture:
Integrated peripherals / components:
Display controller | 3 displays |
Integrated graphics |
GPU
Type:
HD
520 Graphics tier: GT2 Microarchitecture: Gen 9 LP Execution units: 24 Base frequency (MHz): 300 Maximum frequency (MHz): 900 |
Memory controller |
The
number
of
controllers:
1 Memory channels: 2 Supported memory: DDR3L-1600, LPDDR3-1866, DDR4-2133 Maximum memory bandwidth (GB/s): 34.1 |
Other peripherals |
§ PCI Express 3.0 interface (12 lanes) § SATA controller § USB controller § USB OTG § eMMC 5.0 § SDXC 3.0 § Legacy I/O |
Electrical
/
Thermal
parameters:
Maximum operating temperature | 100°C |
Thermal Design Power | 15 Watt |