Core I3-6006U SR2UW CPU Processor Chip , Cpu Microprocessor I3 Series 3MB Cache Up To 2.0GHz

Price	Negotiation
MOQ	1 piece
Delivery Time	3-5 work days
Certification	ORIGINAL PARTS
Model Number	I3-6006U SR2UW
Packaging Details	tray, 10cmX10cmX5cm
Payment Terms	T/T, PayPal, Western Union, Escrow and others
Supply Ability	1000pcs

Product Details

Product Specification

Status	Launched	Code Name	Products formerly SkyLake
Lithography	14nm	Packaging Details	tray, 10cmX10cmX5cm
Porcessor Number	I3-6006U	Vertical Segment	Mobile
Model Number	I3-6006U SR2UW	Use Conditon	NOTEBOOK / LAPTOP
Supply Ability	1000pcs	Certification	ORIGINAL PARTS
Payment Terms	T/T, PayPal, Western Union, Escrow and others	Price	Negotiation
Delivery Time	3-5 work days	Minimum Order Quantity	1 piece
Product Collection	6th Generation Core i3 Processors	Launch Date	Q4'16

Product Description

Core I3-6006U SR2UW CPU Processor Chip I3 Series (3MB Cache,up to 2.0GHz ) - Notebook CPU

The Core i3-6006U is an ULV dual-core processor based on the Skylake architecture, which was officially launched in November 2016. This processor is often used in thin laptops. In addition to two hyperthreading CPU cores running at (relatively low) 2.0 GHz (not Turbo Boost acceleration), the chip also integrates HD Graphics 520 graphics cards (900MHz only) and dual channel DDR4- 2133 / DDR3L-1600 memory controllers. The chip is fabricated by 14 nm process and FinFET transistor.

Processor number i3-6006U

Processor number	i3-6006U
Family	Core i3 Mobile
Technology (micron)	0.014
Processor speed (GHz)	2
L2 cache size (KB)	512
L3 cache size (MB)	3
The number of cores	2
EM64T	Supported
HyperThreading technology	Supported
Virtualization technology	Supported
Enhanced SpeedStep technology	Supported
Execute-Disable bit feature	Supported

General Information:

Type	CPU / Microprocessor
Market segment	Mobile
Family	Intel Core i3 Mobile
Model number	i3-6006U
Frequency	2000 MHz
Clock multiplier	20
Package	1356-ball micro-FCBGA
Socket	BGA1356
Size	1.65" x 0.94" / 4.2cm x 2.4cm
Introduction date	November 2016

Architecture Microarchiteture:

Microarchitecture	Skylake
Processor core	Skylake-U
Core stepping	D1 (SR2UW)
Manufacturing process	0.014 micron
Data width	64 bit
The number of CPU cores	2
The number of threads	4
Floating Point Unit	Integrated
Level 1 cache size	2 x 32 KB 8-way set associative instruction caches 2 x 32 KB 8-way set associative data caches
Level 2 cache size	2 x 256 KB 4-way set associative caches
Level 3 cache size	3 MB 12-way set associative shared cache
Physical memory	32 GB
Multiprocessing	Not supported
Extensions and Technologies	MMX instructions SSE / Streaming SIMD Extensions SSE2 / Streaming SIMD Extensions 2 SSE3 / Streaming SIMD Extensions 3 SSSE3 / Supplemental Streaming SIMD Extensions 3 SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4 AES / Advanced Encryption Standard instructions AVX / Advanced Vector Extensions AVX2 / Advanced Vector Extensions 2.0 BMI / BMI1 + BMI2 / Bit Manipulation instructions F16C / 16-bit Floating-Point conversion instructions FMA3 / 3-operand Fused Multiply-Add instructions EM64T / Extended Memory 64 technology / Intel 64 HT / Hyper-Threading technology VT-x / Virtualization technology VT-d / Virtualization for directed I/O
Security Features	NX / XD / Execute disable bit MPX / Memory Protection Extensions SGX / Software Guard Extensions SMAP / Supervisor Mode Access Prevention SMEP / Secure Mode Execution Protection
Low power features	Enhanced SpeedStep technology

Integrated peripherals / components:

Integrated graphics	GPU Type: HD 520 Graphics tier: GT2 Microarchitecture: Gen 9 LP Execution units: 24 Base frequency (MHz): 300 Maximum frequency (MHz): 900
Memory controller	The number of controllers: 1 Memory channels: 2 Supported memory: DDR3L-1600, LPDDR3-1866, DDR4-2133 Maximum memory bandwidth (GB/s): 34.1
Other peripherals	PCI Express 3.0 interface (12 lanes) SATA controller USB controller USB OTG eMMC 5.0 SDXC 3.0 Legacy I/O